1109676 PHOENIX CONTACT - Technology Bsa

FFKDSA1/H1-5,08- 3 BS:-LQ SO - PCB terminal block

PCB terminal block, nominal current: 15 A, rated voltage (III/2): 400 V, nominal cross section: 1.5 mm², number of rows: 1, number of positions per row: 3, product range: FFKDS(A)/H1, pitch: 5.08 mm, connection method: Push-in spring connection, mounting: Wave soldering, conductor/PCB connection direction: 0°, color: green, Pin layout: Linear pinning, Solder pin [P]: 3.4 mm, number of solder pins per potential: 2, type of packaging: packed in cardboard

Product Code: 1109676

Partner cod.: 1109676

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Product properties	Product line: COMBICON Terminals S Product type: Printed circuit board terminal Product family: FFKDS(A)/H1 Number of positions: 3 Pitch: 5.08 mm Number of rows: 1 Pin layout: Linear pinning Solder pins per potential: 2
Electrical properties	Nominal current I_N: 15 A Nominal voltage U_N: 400 V Degree of pollution: 3 Rated voltage (III/3): 250 V Rated surge voltage (III/3): 4 kV Rated voltage (III/2): 400 V Rated surge voltage (III/2): 4 kV Rated voltage (II/2): 630 V Rated surge voltage (II/2): 4 kV
Connection data	Connection technology Type: PC terminal block can be aligned Nominal cross section: 1.5 mm² Conductor connection Connection method: Push-in spring connection Conductor cross section rigid: 0.2 mm² ... 1.5 mm² Conductor cross section flexible: 0.2 mm² ... 1.5 mm² Conductor cross section AWG: 24 ... 16 Conductor cross section flexible, with ferrule without plastic sleeve: 0.25 mm² ... 0.75 mm² Conductor cross section, flexible, with ferrule, with plastic sleeve: 0.25 mm² ... 0.75 mm² Stripping length: 10 mm
Mounting	Mounting type: Wave soldering Pin layout: Linear pinning Connection method: Push-in spring connection
Material specifications	Material data - contact Note: WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201 Contact material: Cu alloy Surface characteristics: Tin-plated Metal surface terminal point (top layer): Tin (5 - 7 Ãµm Sn) Metal surface terminal point (middle layer): Nickel (2 - 3 Ãµm Ni) Metal surface soldering area (top layer): Tin (5 - 7 Ãµm Sn) Metal surface soldering area (middle layer): Nickel (2 - 3 Ãµm Ni) Material data - housing Color (Housing): green (6021) Insulating material: PA Insulating material group: I CTI according to IEC 60112: 600 Flammability rating according to UL 94: V0 Glow wire flammability index GWFI according to ENÃ60695-2-12: 850 Glow wire ignition temperature GWIT according to ENÃ60695-2-13: 775 Temperature for the ball pressure test according to ENÃ60695-10-2: 125°C Material data Ã¢Ã¢¬Ã¢ actuating element Color (Actuating element): orange (2003) Insulating material: PA Insulating material group: I CTI according to IEC 60112: 600 Flammability rating according to UL 94: V0 Glow wire flammability index GWFI according to ENÃ60695-2-12: 850 Glow wire ignition temperature GWIT according to ENÃ60695-2-13: 775 Temperature for the ball pressure test according to ENÃ60695-10-2: 125°C
Dimensions	Dimensional drawing: https://dam-mdc.phoenixcontact.com/rendition/156443151564/158b0afe23d1ab408f646eacfe25f655/-S204x204-FJPG Pitch: 5.08 mm Width [w]: 17.74 mm Height [h]: 16.15 mm Length [l]: 13.65 mm Installed height: 12.75 mm Solder pin length [P]: 3.4 mm Pin dimensions: 0.5 x 1 mm PCB design Pin spacing: 7.62 mm Hole diameter: 1.3 mm
Electrical tests	Air clearances and creepage distances \| Specification: IEC 60947-1:2007-06 + A1:2010-12 + A2:2014-09 Insulating material group: I Comparative tracking index (IEC 60112): CTI 600 Rated insulation voltage (III/3): 250 V Rated surge voltage (III/3): 4 kV minimum clearance value - non-homogenous field (III/3): 3 mm minimum creepage distance (III/3): 3.2 mm Rated insulation voltage (III/2): 400 V Rated surge voltage (III/2): 4 kV minimum clearance value - non-homogenous field (III/2): 3 mm minimum creepage distance (III/2): 3 mm Rated insulation voltage (II/2): 630 V Rated surge voltage (II/2): 4 kV minimum clearance value - non-homogenous field (II/2): 3 mm minimum creepage distance (II/2): 3.2 mm
Environmental and real-life conditions	Ambient conditions Ambient temperature (operation): -40°C ... 100°C (Depending on the current carrying capacity/derating curve) Ambient temperature (storage/transport): -40°C ... 70°C Relative humidity (storage/transport): 30 % ... 70 % Ambient temperature (assembly): -5°C ... 100°C
Packaging specifications	Type of packaging: packed in cardboard