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PHOENIX CONTACT 1332646
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CUC-USB3.1-J1ST-S/UCF-SMD - USB PCB connectors

USB PCB connectors, degree of protection: IP20, number of positions: 24, 10 Gbps, material: Metal, connection method: Solder connection
Product Code: 1332646
Partner cod.: 1332646
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Tecnichal data
Technical Specs
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Tecnichal data
Product propertiesType: USB-C
Socket
Product type: Data connector (device side)
Number of positions: 24
Type of packaging: Tape and Reel
[W] tape width: 24.00 mm
[A] coil diameter: 330.00 mm
Connection profile: USB-C
Number of slots: 1
Shielded: yes
Insulation characteristics
Overvoltage category: I
Degree of pollution: 2
Electrical propertiesRated voltage (III/2): 20 V
Rated surge voltage (III/2): 1500 V
Rated current: 5 A
Contact resistance: 40 mΩ
Frequency range: 10 Hz ... 55 Hz
Insulation resistance: 100 MΩ
Transmission medium: Copper
Transmission characteristics (category): USB 3.2 Gen 2
Transmission speed: 10 Gbps
Power transmission: 100 W
Connection dataConnection technology
Connection method: Solder connection
DimensionsWidth: 11 mm
Height: 3.16 mm
Length: 6.6 mm
Orientation to: 180.00°
Material specificationsColor of the housing part: black
Material: Gold-plated
Nickel coating 50µ min
Tin coating 100µ min
Nickel coating 50µ min
LCP
Flammability rating according to UL 94: V0
Contact material: Copper alloy
Contact surface material: Gold over nickel
Contact carrier material: LCP
Housing material: Metal
Cable/lineTest voltage Core/Core: 100 V
Test voltage Core/Shield: 100 V
Acceleration: 3.1 m/s²
Halogen-free: yes
Mechanical propertiesMechanical data
Insertion/withdrawal cycles: > 10000
Insertion force per signal contact: 20.00 N
Extraction force per signal contact: < 8 N
Environmental and real-life conditionsTest specification
Specification: EIA 364-1000
Frequency: 10-55 Hz
Sweep speed: 1octave/min
Amplitude: 1.52 mm
Test duration: 2 h
Contact resistance R1: 40 mΩ
Test specification​
Specification: 60068-2-27
Acceleration: 50 g
Number of shocks per direction: 18
Ambient conditions
Degree of protection: IP20
Ambient temperature (operation): -55°C ... 85°C
MountingMounting type: SMD soldering
Connection method: Solder connection
Processing notes
Process: SMD
Moisture Sensitive Level: MSL 1
Classification temperature Tc: 260°C
Solder cycles in the reflow: 3
Technical Specs
ECLASSECLASS-11.0: 27440390
ECLASS-12.0: 27440390
ECLASS-13.0: 27460201
UNSPSCUNSPSC 21.0: 39121400
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