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PHOENIX CONTACT 1702610
PHOENIX CONTACTNot available

PTQ 0,3/ 2-2,5 THR R32 - PCB terminal block

PCB terminal block, nominal current: 4 A, rated voltage (III/2): 160 V, nominal cross section: 0.34 mm2, number of potentials: 2, number of rows: 1, number of positions per row: 2, product range: PTQ 0,3/..-THR, pitch: 2.5 mm, connection method: Displacement connection, mounting: THR soldering, conductor/PCB connection direction: 0 °, color: black, Pin layout: Zigzag pinning W, Solder pin [P]: 2 mm, number of solder pins per potential: 1, type of packaging: 32 mm wide tape. Suitable for CAT5
Product Code: 1702610
Partner cod.: 1702610
PHOENIX CONTACT


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Tecnichal data
Technical Specs
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Tecnichal data
Product propertiesType: PC termination block
Product line: COMBICON Terminals XS
Product type: Printed circuit board terminal
Product family: PTQ 0,3/..-THR
Number of positions: 2
Pitch: 2.5 mm
Number of connections: 2
Number of rows: 1
Number of potentials: 2
Pin layout: Zigzag pinning W
Solder pins per potential: 1
Electrical propertiesNominal current IN: 4 A
Nominal voltage UN: 160 V
Degree of pollution: 3
Rated voltage (III/3): 160 V
Rated surge voltage (III/3): 2.5 kV
Rated voltage (III/2): 160 V
Rated surge voltage (III/2): 2.5 kV
Rated voltage (II/2): 200 V
Rated surge voltage (II/2): 2.5 kV
Connection dataConnection technology
Type: PC termination block
Nominal cross section: 0.34 mm²
Conductor connection
Connection method: Displacement connection
Conductor cross section rigid: 0.14 mm² ... 0.34 mm²
Conductor cross section flexible: 0.14 mm² ... 0.34 mm²
Conductor cross section AWG: 26 ... 22
MountingMounting type: THR soldering
Pin layout: Zigzag pinning W
Connection method: Displacement connection
Processing notes
Process: Reflow/wave soldering
Moisture Sensitive Level: MSL 1
Classification temperature Tc: 260°C
Solder cycles in the reflow: 3
Material specificationsMaterial data - contact
Note: WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201
Contact material: Cu alloy
Surface characteristics: hot-dip tin-plated
Metal surface terminal point (top layer): Tin (3 - 5 µm Sn)
Metal surface terminal point (middle layer): Nickel (1.3 - 3 µm Ni)
Metal surface soldering area (top layer): Tin (3 - 5 µm Sn)
Metal surface soldering area (middle layer): Nickel (1.3 - 3 µm Ni)
Material data - housing
Color (Housing): black (9005)
Insulating material: LCP
Insulating material group: IIIa
CTI according to IEC 60112: 175
Flammability rating according to UL 94: V0
NotesGeneral: The item is qualified for CAT5 Ethernet applications. For this reason, it is suited for use in IoT devices.
DimensionsDimensional drawing: https://dam-mdc.phoenixcontact.com/rendition/156443151564/158b0afe23d1ab408f646eacfe25f655/-S204x204-FJPG
Pitch: 2.5 mm
Width [w]: 7 mm
Height [h]: 10 mm
Length [l]: 17.55 mm
Installed height: 8 mm
Solder pin length [P]: 2 mm
Pin dimensions: 0.9 x 0.4 mm
PCB design
Pin spacing: 2.5 mm
Hole diameter: 1.1 mm
Mechanical testsConnection test
Specification: IEC 60998-2-3:2002-12
Result: Test passed
Pull-out test
Specification: IEC 60999-1:1999-11
Conductor cross section/conductor type/tractive force setpoint/actual value: 0.2 mm² / solid / > 10 N
0.2 mm² / flexible / > 10 N
Electrical testsTemperature-rise test
Specification: IEC 60998-1:2002-12
Requirement temperature-rise test: Increase in temperature ≤45K
Short-time withstand current
Specification: IEC 60998-2-3:2002-12
Insulation resistance
Specification: IEC 60512-3-1:2002-02
Insulation resistance, neighboring positions: >5MΩ
Temperature cycles
Specification: IEC 60998-2-3:2002-12
Result: Test passed
Air clearances and creepage distances |
Specification: IEC 60664-1:2007-04
Insulating material group: IIIa
Comparative tracking index (IEC 60112): CTI 175
Rated insulation voltage (III/3): 160 V
Rated surge voltage (III/3): 2.5 kV
minimum clearance value - non-homogenous field (III/3): 1.5 mm
minimum creepage distance (III/3): 2.5 mm
Rated insulation voltage (III/2): 160 V
Rated surge voltage (III/2): 2.5 kV
minimum clearance value - non-homogenous field (III/2): 1.5 mm
minimum creepage distance (III/2): 1.6 mm
Rated insulation voltage (II/2): 200 V
Rated surge voltage (II/2): 2.5 kV
minimum clearance value - non-homogenous field (II/2): 1.5 mm
minimum creepage distance (II/2): 2 mm
Environmental and real-life conditionsGlow-wire test
Specification: IEC 60998-1:2002-12
Time of exposure: 5 s
Shocks
Specification: IEC 60068-2-27:2008-02
Pulse shape: Half-sine
Acceleration: 15g
Shock duration: 11ms
Test directions: X-, Y- and Z-axis
Ambient conditions
Ambient temperature (operation): -40°C ... 100°C (Depending on the current carrying capacity/derating curve)
Ambient temperature (storage/transport): -40°C ... 70°C
Relative humidity (storage/transport): 30 % ... 70 %
Ambient temperature (assembly): -5°C ... 100°C
Packaging specificationsDimensional drawing: https://dam-mdc.phoenixcontact.com/rendition/156443151564/5c9d0417f989e646afbbef42108ede86/-S204x204-FJPG
Type of packaging: 32 mm wide tape
[W] tape width: 32 mm
[W2] coil overall dimension: 38.4 mm
[A] coil diameter: 330 mm
Outer packaging type: Transparent-Bag
ESD level: (D) electrostatically conductive
Specification: DINEN61340-5-1 (VDE0300-5-1): 2008-07
Technical Specs
ECLASSECLASS-11.0: 27460101
ECLASS-12.0: 27460101
ECLASS-13.0: 27460101
ETIMETIM 9.0: EC002643
UNSPSCUNSPSC 21.0: 39121400
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Technical_drawing_18987.pdf

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