1732399 PHOENIX CONTACT - Technology Bsa

SPT 2,5/ 3-H-5,0-EX - PCB terminal block

PCB terminal block, nominal current: 23 A, nominal cross section: 2.5 mm², number of potentials: 3, number of rows: 1, number of positions per row: 3, product range: SPT 2,5/..-H-EX, pitch: 5 mm, connection method: Push-in spring connection, mounting: Wave soldering, conductor/PCB connection direction: 0 °, color: green, Pin layout: Linear pinning, Solder pin [P]: 2.5 mm, number of solder pins per potential: 2, type of packaging: packed in cardboard

Product Code: 1732399

Partner cod.: 1732399

PHOENIX CONTACT

Product properties	Product line: COMBICON Terminals M Product type: Printed circuit board terminal Product family: SPT 2,5/..-H-EX Number of positions: 3 Pitch: 5 mm Number of connections: 3 Number of rows: 1 Number of potentials: 3 Pin layout: Linear pinning Solder pins per potential: 2
Electrical properties	Nominal current I_N: 23 A Nominal voltage U_N: 176 V Rated current / conductor cross section: 23 A/2.5 mm² Degree of pollution: 3 Rated voltage (III/3): 176 V
Ex data	Ex approval Identification: 0344Ã¯ II 2GD / Ex eb IIC Gb EU-type examination certificate: KEMA 07ATEX0193 U IECEx certificate: IECEx KEM 07.0057 U
Connection data	Connection technology Nominal cross section: 2.5 mm² Conductor connection Connection method: Push-in spring connection Conductor cross section rigid: 0.2 mm² ... 4 mm² Conductor cross section flexible: 0.2 mm² ... 2.5 mm² Conductor cross section AWG: 24 ... 14 Conductor cross section flexible, with ferrule without plastic sleeve: 0.25 mm² ... 2.5 mm² (Stripping length 8 mm) Conductor cross section, flexible, with ferrule, with plastic sleeve: 0.25 mm² ... 1.5 mm² (Stripping length 8 mm) Stripping length: 10 mm
Mounting	Mounting type: Wave soldering Pin layout: Linear pinning Connection method: Push-in spring connection
Material specifications	Material data - contact Note: WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201 Contact material: Cu alloy Surface characteristics: hot-dip tin-plated Metal surface terminal point (top layer): Tin (4 - 8 µm Sn) Metal surface soldering area (top layer): Tin (4 - 8 µm Sn) Material data - housing Color (Housing): green (6021) Insulating material: PA Insulating material group: I CTI according to IEC 60112: 600 Flammability rating according to UL 94: V0 Glow wire flammability index GWFI according to EN60695-2-12: 850 Glow wire ignition temperature GWIT according to EN60695-2-13: 775 Temperature for the ball pressure test according to EN60695-10-2: 125°C
Notes	Note on application: Rated insulation voltage with pitch spacer RZ-SPT2,5-2,5: 275V RZ-SPT2,5-5,0: 440V
Dimensions	Dimensional drawing: https://dam-mdc.phoenixcontact.com/rendition/156443151564/158b0afe23d1ab408f646eacfe25f655/-S204x204-FJPG Pitch: 5 mm Width [w]: 16.4 mm Height [h]: 16 mm Length [l]: 14.4 mm Installed height: 13.5 mm Solder pin length [P]: 2.5 mm Pin dimensions: 0.8 x 0.8 mm PCB design Pin spacing: 8.2 mm Hole diameter: 1.2 mm
Mechanical tests	Connection test Specification: IEC 60998-2-2:2002-12 Result: Test passed Test for conductor damage and slackening Specification: IEC 60998-2-2:2002-12 Result: Test passed Pull-out test Specification: IEC 60998-2-2:2002-12 Conductor cross section/conductor type/tractive force setpoint/actual value: 0.2 mm² / solid / > 10 N 0.2 mm² / flexible / > 10 N 4 mm² / solid / > 60 N 2.5 mm² / flexible / > 50 N
Electrical tests	Temperature-rise test Specification: IEC 60998-2-1:2002-12 Requirement temperature-rise test: Increase in temperature Ã¢¤45K Insulation resistance Specification: IEC 60998-1:2002-12 Insulation resistance, neighboring positions: 10⁹Ã© Air clearances and creepage distances \| Insulating material group: I Comparative tracking index (IEC 60112): CTI 600 Rated insulation voltage (III/3): 176 V minimum clearance value - non-homogenous field (III/3): 3 mm minimum creepage distance (III/3): 3.2 mm minimum clearance value - non-homogenous field (III/2): 3 mm minimum creepage distance (III/2): 3 mm minimum clearance value - non-homogenous field (II/2): 3 mm minimum creepage distance (II/2): 3.2 mm
Environmental and real-life conditions	Vibration test Specification: IEC 60068-2-6:1995-03 Frequency: 10 - 150 - 10 Hz Sweep speed: 1octave/min 5g (60.1Hz...150Hz) Amplitude: 0.35mm (10Hz...60.1Hz) Test duration per axis: 2.5 h Glow-wire test Specification: IEC 60998-1:2002-12 Temperature: 850°C Time of exposure: 5 s Ambient conditions Ambient temperature (operation): -50°C ... 110°C Ambient temperature (storage/transport): -40°C ... 70°C Relative humidity (storage/transport): 30 % ... 70 % Ambient temperature (assembly): -5°C ... 100°C
Packaging specifications	Type of packaging: packed in cardboard