1821342 PHOENIX CONTACT - Technology Bsa

MC 0,5/12-G-2,54 P20 THR R56 - PCB header

PCB headers, nominal cross section: 0.5 mm², color: black, nominal current: 6 A, rated voltage (III/2): 160 V, contact surface: Gold, contact connection type: Pin, number of potentials: 12, number of rows: 1, number of positions: 12, number of connections: 12, product range: MC 0,5/..-G-THR, pitch: 2.54 mm, mounting: THR soldering, pin layout: Linear pinning, solder pin [P]: 2 mm, number of solder pins per potential: 1, plug-in system: COMBICON FMC 0,5, Pin connector pattern alignment: Standard, locking: without, mounting: without, type of packaging: 56 mm wide tape, Sample values available under SAMPLE MC...

Product Code: 1821342

Partner cod.: 1821342

PHOENIX CONTACT

Product properties	Type: Component suitable for through hole reflow Product line: COMBICON Connectors XS Product type: PCB headers Product family: MC 0,5/..-G-THR Number of positions: 12 Pitch: 2.54 mm Number of connections: 12 Number of rows: 1 Mounting flange: without Number of potentials: 12 Pin layout: Linear pinning Solder pins per potential: 1
Electrical properties	Nominal current I_N: 6 A Nominal voltage U_N: 160 V Degree of pollution: 3 Contact resistance: 2.1 mÃ© Rated voltage (III/3): 32 V Rated surge voltage (III/3): 2.5 kV Rated voltage (III/2): 160 V Rated surge voltage (III/2): 2.5 kV Rated voltage (II/2): 160 V Rated surge voltage (II/2): 2.5 kV
Mounting	Mounting type: THR soldering Pin layout: Linear pinning Processing notes Process: Reflow/wave soldering Moisture Sensitive Level: MSL 1 Classification temperature T_c: 260°C Solder cycles in the reflow: 3
Material specifications	Material data - contact Note: WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201 Contact material: Cu alloy Surface characteristics: Completely gold-plated Metal surface contact area (top layer): Gold (0.25 Au) Metal surface contact area (middle layer): Nickel (2 - 4 Ãµm Ni) Metal surface soldering area (top layer): Gold (0.25 Au) Metal surface soldering area (middle layer): Nickel (2 - 4 Ãµm Ni) Material data - housing Color (Housing): black (9005) Insulating material: LCP Insulating material group: IIIa CTI according to IEC 60112: 175 Flammability rating according to UL 94: V0
Dimensions	Dimensional drawing: https://dam-mdc.phoenixcontact.com/rendition/156443151564/2464924391ea904289a8463658d8e4b7/-S204x204-FJPG Pitch: 2.54 mm Width [w]: 35.06 mm Height [h]: 6.85 mm Length [l]: 7.1 mm Installed height: 4.85 mm Solder pin length [P]: 2 mm Pin dimensions: 0.64 x 0.64 mm PCB design Pin spacing: 2.54 mm Hole diameter: 1.2 mm
Mechanical tests	Visual inspection Specification: IEC 60512-1-1:2002-02 Result: Test passed Dimension check Specification: IEC 60512-1-2:2002-02 Result: Test passed Resistance of inscriptions Specification: IEC 60068-2-70:1995-12 Result: Test passed Polarization and coding Specification: IEC 60512-13-5:2006-02 Result: Test passed Contact holder in insert Specification: IEC 60512-15-1:2008-05 Contact holder in insert Requirements >20 N: Test passed Insertion and withdrawal forces Result: Test passed No. of cycles: 100 Insertion strength per pos. approx.: 2 N Withdraw strength per pos. approx.: 3 N
Electrical tests	Thermal test \| Test group C Specification: IEC 60512-5-1:2002-02 Tested number of positions: 16 Insulation resistance Specification: IEC 60512-3-1:2002-02 Insulation resistance, neighboring positions: >Ã5ÃMÃ© Air clearances and creepage distances \| Specification: IEC 60664-1:2007-04 Insulating material group: IIIa Comparative tracking index (IEC 60112): CTI 175 Rated insulation voltage (III/3): 32 V Rated surge voltage (III/3): 2.5 kV minimum clearance value - non-homogenous field (III/3): 1.5 mm minimum creepage distance (III/3): 1.5 mm Rated insulation voltage (III/2): 160 V Rated surge voltage (III/2): 2.5 kV minimum clearance value - non-homogenous field (III/2): 1.5 mm minimum creepage distance (III/2): 1.6 mm Rated insulation voltage (II/2): 160 V Rated surge voltage (II/2): 2.5 kV minimum clearance value - non-homogenous field (II/2): 1.5 mm minimum creepage distance (II/2): 1.6 mm
Environmental and real-life conditions	Vibration test Specification: IEC 60068-2-6:2007-12 Frequency: 10 - 500 - 10 Hz Sweep speed: 1Ãoctave/min 5g (60.1ÃHzÃ...Ã500ÃHz) Amplitude: 0.35Ãmm (10ÃHzÃ...Ã60.1ÃHz) Test duration per axis: 2 h Durability test Specification: IEC 60512-9-1:2010-03 Impulse withstand voltage at sea level: 2.95 kV Contact resistance R₁: 2.1 mÃ© Contact resistance R₂: 2.1 mÃ© Insertion/withdrawal cycles: 100 Insulation resistance, neighboring positions: >Ã5ÃMÃ© Climatic test Specification: DINÃ50018:2013-05 Corrosive stress: 1.0 dm³ SO₂ on 300 dm³/40°C/1 cycle Thermal stress: 105Ã°C/168Ãh Power-frequency withstand voltage: 1.39 kV Ambient conditions Ambient temperature (operation): -40°C ... 100°C (dependent on the derating curve) Ambient temperature (storage/transport): -40°C ... 70°C Relative humidity (storage/transport): 30 % ... 70 % Ambient temperature (assembly): -5°C ... 100°C
Packaging specifications	Dimensional drawing: https://dam-mdc.phoenixcontact.com/rendition/156443151564/5c9d0417f989e646afbbef42108ede86/-S204x204-FJPG Type of packaging: 56 mm wide tape [W] tape width: 56 mm [W2] coil overall dimension: 62.4 mm [A] coil diameter: 330 mm Outer packaging type: Transparent-Bag ESD level: (D) electrostatically conductive Specification: DINÃENÃ61340-5-1 (VDEÃ0300-5-1): 2008-07