Automazione Industriale

Meccatronica

Sicurezza Industriale

Componenti Quadri

Sensori e Sistemi di Visione

Pneumatica

Network e Comunicazione

Cavi Speciali

Software di progettazione

Accedi ai servizi

Entra nella tua area riservata

Accedi ai servizi

Entra nella tua area riservata

PHOENIX CONTACT 1054368
PHOENIX CONTACTNon disponibile

MC 0,5/ 3-G-2,54 GN P20 THRR24 - PCB header

PCB headers, nominal cross section: 0.5 mm2, color: green, nominal current: 6 A, rated voltage (III/2): 160 V, contact surface: Gold, contact connection type: Pin, number of rows: 1, number of positions: 3, product range: MC 0,5/..-G-THR, pitch: 2.54 mm, mounting: THR soldering, pin layout: Linear pinning, solder pin [P]: 2 mm, number of solder pins per potential: 1, plug-in system: COMBICON FMC 0,5, Pin connector pattern alignment: Standard, locking: without, mounting: without, type of packaging: 24 mm wide tape
Cod. Articolo: 1054368
Cod. Fornitore: 1054368
PHOENIX CONTACT


Diminuisci la quantità
Aumenta la quantità
Caratteristiche Tecniche
Specifiche
Download
Caratteristiche Tecniche
Product propertiesProduct line: COMBICON Connectors XS
Product type: PCB headers
Product family: MC 0,5/..-G-THR
Number of positions: 3
Pitch: 2.54 mm
Number of rows: 1
Pin layout: Linear pinning
Solder pins per potential: 1
Electrical propertiesNominal current IN: 6 A
Nominal voltage UN: 160 V
Degree of pollution: 3
Contact resistance: 2.1 mΩ
Rated voltage (III/3): 32 V
Rated surge voltage (III/3): 2.5 kV
Rated voltage (III/2): 160 V
Rated surge voltage (III/2): 2.5 kV
Rated voltage (II/2): 160 V
Rated surge voltage (II/2): 2.5 kV
MountingMounting type: THR soldering
Pin layout: Linear pinning
Processing notes
Process: Reflow/wave soldering
Moisture Sensitive Level: MSL 1
Classification temperature Tc: 260°C
Solder cycles in the reflow: 3
Material specificationsMaterial data - contact
Note: WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201
Contact material: Cu alloy
Surface characteristics: Completely gold-plated
Metal surface contact area (top layer): Gold (0.25 Au)
Metal surface contact area (middle layer): Nickel (2 - 4 µm Ni)
Metal surface soldering area (top layer): Gold (0.25 Au)
Metal surface soldering area (middle layer): Nickel (2 - 4 µm Ni)
Material data - housing
Color (Housing): green (6021)
Insulating material: LCP
Insulating material group: IIIa
CTI according to IEC 60112: 175
Flammability rating according to UL 94: V0
DimensionsDimensional drawing: https://dam-mdc.phoenixcontact.com/rendition/156443151564/2464924391ea904289a8463658d8e4b7/-S204x204-FJPG
Pitch: 2.54 mm
Width [w]: 12.2 mm
Height [h]: 6.85 mm
Length [l]: 7.1 mm
Installed height: 4.85 mm
Solder pin length [P]: 2 mm
Pin dimensions: 0.64 x 0.64 mm
PCB design
Pin spacing: 2.54 mm
Hole diameter: 1.2 mm
Mechanical testsVisual inspection
Specification: IEC 60512-1-1:2002-02
Result: Test passed
Dimension check
Specification: IEC 60512-1-2:2002-02
Result: Test passed
Resistance of inscriptions
Specification: IEC 60068-2-70:1995-12
Result: Test passed
Polarization and coding
Specification: IEC 60512-13-5:2006-02
Result: Test passed
Contact holder in insert
Specification: IEC 60512-15-1:2008-05
Contact holder in insert
Requirements >20 N: Test passed
Insertion and withdrawal forces
Result: Test passed
No. of cycles: 100
Insertion strength per pos. approx.: 2 N
Withdraw strength per pos. approx.: 3 N
Electrical testsThermal test | Test group C
Specification: IEC 60512-5-1:2002-02
Tested number of positions: 16
Insulation resistance
Specification: IEC 60512-3-1:2002-02
Insulation resistance, neighboring positions: >5MΩ
Air clearances and creepage distances |
Specification: IEC 60664-1:2007-04
Insulating material group: IIIa
Comparative tracking index (IEC 60112): CTI 175
Rated insulation voltage (III/3): 32 V
Rated surge voltage (III/3): 2.5 kV
minimum clearance value - non-homogenous field (III/3): 1.5 mm
minimum creepage distance (III/3): 1.5 mm
Rated insulation voltage (III/2): 160 V
Rated surge voltage (III/2): 2.5 kV
minimum clearance value - non-homogenous field (III/2): 1.5 mm
minimum creepage distance (III/2): 1.6 mm
Rated insulation voltage (II/2): 160 V
Rated surge voltage (II/2): 2.5 kV
minimum clearance value - non-homogenous field (II/2): 1.5 mm
minimum creepage distance (II/2): 1.6 mm
Environmental and real-life conditionsVibration test
Specification: IEC 60068-2-6:2007-12
Frequency: 10 - 500 - 10 Hz
Sweep speed: 1octave/min
5g (60.1Hz...500Hz)
Amplitude: 0.35mm (10Hz...60.1Hz)
Test duration per axis: 2 h
Durability test
Specification: IEC 60512-9-1:2010-03
Impulse withstand voltage at sea level: 2.95 kV
Contact resistance R1: 2.1 mΩ
Contact resistance R2: 2.1 mΩ
Insertion/withdrawal cycles: 100
Insulation resistance, neighboring positions: >5MΩ
Climatic test
Specification: DIN50018:2013-05
Corrosive stress: 1.0 dm3 SO2 on 300 dm3/40°C/1 cycle
Thermal stress: 105°C/168h
Power-frequency withstand voltage: 1.39 kV
Ambient conditions
Ambient temperature (operation): -40°C ... 100°C (dependent on the derating curve)
Ambient temperature (storage/transport): -40°C ... 70°C
Relative humidity (storage/transport): 30 % ... 70 %
Ambient temperature (assembly): -5°C ... 100°C
Packaging specificationsDimensional drawing: https://dam-mdc.phoenixcontact.com/rendition/156443151564/5c9d0417f989e646afbbef42108ede86/-S204x204-FJPG
Type of packaging: 24 mm wide tape
[W] tape width: 24 mm
[W2] coil overall dimension: 30.4 mm
[A] coil diameter: 330 mm
Outer packaging type: Transparent-Bag
ESD level: (D) electrostatically conductive
Specification: DINEN61340-5-1 (VDE0300-5-1): 2008-07
Specifiche
ECLASSECLASS-11.0: 27460201
ECLASS-12.0: 27460201
ECLASS-13.0: 27460201
ETIMETIM 8.0: EC002637
UNSPSCUNSPSC 21.0: 39121400
Download
PER SCARICARE I DOCUMENTI E' NECESSARIO EFFETTUARE L'ACCESSO AL SITO

Approvals_00366.pdf

Approvals_00400.pdf

Manufacturer_declaration_05483.pdf

Technical_drawing_06877.pdf

Technical_drawing_06878.pdf