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PHOENIX CONTACT 1149874
PHOENIX CONTACTNon disponibile

CUC-SP-J1ST-A/R4LB-SMD - RJ45 PCB connectors

RJ45 PCB connectors, degree of protection: IP20, 10 Gbps, material: Metal, connection method: SMD reflow
Cod. Articolo: 1149874
Cod. Fornitore: 1149874
PHOENIX CONTACT


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Caratteristiche Tecniche
Specifiche
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Caratteristiche Tecniche
Product propertiesType: RJ45
Socket
Product type: Data connector (device side)
Type of packaging: Tape and Reel
[W] tape width: 44.00 mm
[A] coil diameter: 330.00 mm
[W2] coil overall dimension: 49.00 mm
Housing shield springs: No
Connection profile: RJ45
Number of slots: 1
Shielded: yes
Insulation characteristics
Overvoltage category: I
Degree of pollution: 2
Electrical propertiesRated voltage (III/2): 72 VDC
Rated surge voltage: 1.5 kV DC
1 kV DC
Rated surge voltage (III/3): 1.5 kV
Rated current: 1.5 A
Frequency range: 10 Hz ... 500 Hz
Insulation resistance: > 500 MΩ
Test voltage: 1 kV DC
Test voltage Core/Core: 1 kV DC
Test voltage Core/Shield: 1.5 kV DC
Transmission medium: Copper
Transmission speed: 10 Gbps
Power transmission: PoE++
Connection dataConnection technology
Connection method: SMD reflow
DimensionsWidth: 18.1 mm
Height: 15 mm
Length: 20.85 mm
Installed height: 11.80 mm
Orientation to: 90.00°
Material specificationsMaterial: Au (0.152µm / 6 µ")
Ni (1.27µm / 50 µ")
Ni (1.27µm / 50 µ")
Sn (2.54µm/100µ")
Copper alloy
Flammability rating according to UL 94: V0
Housing surface material: Nickel
Contact material: Phosphor bronze
Contact surface material: Gold
Contact carrier material: PA 9T GF
Housing material: Metal
Cable/lineTest voltage Core/Core: 1 kV DC
Test voltage Core/Shield: 1.5 kV DC
Halogen-free: no
Flame resistance: UL94 V0
Mechanical propertiesMechanical data
Insertion/withdrawal cycles: > 750
Insertion force per signal contact: < 20.00 N
Extraction force per signal contact: < 20 N
Environmental and real-life conditionsTest specification
Frequency: 10-500 Hz
Sweep speed: 1octave/min
Amplitude: 0.35 mm
Acceleration: 50 m/s²
Test duration: 20 s
Test specification​
Specification: IEC60068-2-27
Acceleration: 295 m/s²
Ambient conditions
Degree of protection: IP20
Ambient temperature (operation): -40°C ... 85°C
Ambient temperature (storage/transport): -40°C ... 85°C
Standards and regulationsFlame resistance: UL94 V0
MountingMounting type: SMD soldering
Connection method: SMD reflow
Processing notes
Moisture Sensitive Level: MSL 1
Classification temperature Tc: 260°C
Solder cycles in the reflow: 3
Specifiche
ECLASSECLASS-11.0: 27440223
ECLASS-12.0: 27440223
ECLASS-13.0: 27440223
ETIMETIM 9.0: EC003557
UNSPSCUNSPSC 21.0: 39121400
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