1700921 PHOENIX CONTACT - Technology Bsa

IMCV 1,5/ 5-G-3,81 GY AU - PCB header

PCB headers, nominal cross section: 1.5 mm², color: gray, nominal current: 8 A, rated voltage (III/2): 160 V, contact surface: Gold, contact connection type: Socket, number of potentials: 5, number of rows: 1, number of positions: 5, number of connections: 5, product range: IMCV 1,5/..-G, pitch: 3.81 mm, mounting: Wave soldering, pin layout: Linear pinning, solder pin [P]: 3.4 mm, number of solder pins per potential: 2, plug-in system: COMBICON MC 1,5, Pin connector pattern alignment: Standard, locking: without, mounting: without, type of packaging: packed in cardboard

Cod. Articolo: 1700921

Cod. Fornitore: 1700921

PHOENIX CONTACT

Product properties	Product line: COMBICON Connectors S Product type: PCB headers Product family: IMCV 1,5/..-G Number of positions: 5 Pitch: 3.81 mm Number of connections: 5 Number of rows: 1 Mounting flange: without Number of potentials: 5 Pin layout: Linear pinning Solder pins per potential: 2
Electrical properties	Nominal current I_N: 8 A Nominal voltage U_N: 160 V Degree of pollution: 3 Rated voltage (III/3): 160 V Rated surge voltage (III/3): 2.5 kV Rated voltage (III/2): 160 V Rated surge voltage (III/2): 2.5 kV Rated voltage (II/2): 320 V Rated surge voltage (II/2): 2.5 kV
Mounting	Mounting type: Wave soldering Pin layout: Linear pinning
Material specifications	Material data - contact Note: WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201 Contact material: Cu alloy Surface characteristics: partially gold-plated Metal surface contact area (top layer): Gold (0.8 - 1.4 µm Au) Metal surface contact area (middle layer): Nickel (2 - 4 µm Ni) Metal surface soldering area (top layer): Tin (2 - 4 µm Sn) Material data - housing Color (Housing): gray (7042) Insulating material: PA Insulating material group: I CTI according to IEC 60112: 600 Flammability rating according to UL 94: V0 Glow wire flammability index GWFI according to EN60695-2-12: 850 Glow wire ignition temperature GWIT according to EN60695-2-13: 775 Temperature for the ball pressure test according to EN60695-10-2: 125 °C
Dimensions	Dimensional drawing: https://dam-mdc.phoenixcontact.com/rendition/156443151564/70e0f23c282363459709fcfe7d5e7131/-S204x204-FJPG Pitch: 3.81 mm Width [w]: 19.84 mm Height [h]: 17.9 mm Length [l]: 6.85 mm Installed height: 14.5 mm Solder pin length [P]: 3.4 mm Pin dimensions: 1.12 mm PCB design Hole diameter: 1.2 mm
Electrical tests	Air clearances and creepage distances \| Specification: IEC60664-1:2007-04 Insulating material group: I Comparative tracking index (IEC60112): CTI 600 Rated insulation voltage (III/3): 160 V Rated surge voltage (III/3): 2.5 kV minimum clearance value - non-homogenous field (III/3): 1.5 mm minimum creepage distance (III/3): 2 mm Rated insulation voltage (III/2): 160 V Rated surge voltage (III/2): 2.5 kV minimum clearance value - non-homogenous field (III/2): 1.5 mm minimum creepage distance (III/2): 1.5 mm Rated insulation voltage (II/2): 320 V Rated surge voltage (II/2): 2.5 kV minimum clearance value - non-homogenous field (II/2): 1.5 mm minimum creepage distance (II/2): 1.6 mm
Environmental and real-life conditions	Ambient conditions Ambient temperature (operation): -40 °C ... 100 °C (Depending on the current carrying capacity/derating curve) Ambient temperature (storage/transport): -40 °C ... 70 °C Relative humidity (storage/transport): 30 % ... 70 % Ambient temperature (assembly): -5 °C ... 100 °C
Packaging specifications	Type of packaging: packed in cardboard