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PHOENIX CONTACT 1770607
PHOENIX CONTACTNon disponibile

MSTBW 2,5/ 3-G-5,08 HT P26 R32 - PCB header

PCB headers, nominal cross section: 2.5 mm2, color: black, nominal current: 12 A, contact surface: Tin, contact connection type: Pin, number of potentials: 3, number of rows: 1, number of positions: 3, number of connections: 3, product range: MSTBW 2,5/..-G, pitch: 5.08 mm, mounting: THR soldering, pin layout: Linear pinning, solder pin [P]: 2.6 mm, number of solder pins per potential: 1, plug-in system: COMBICON MSTB 2,5, Pin connector pattern alignment: Standard, locking: without, mounting: without, type of packaging: 32 mm wide tape
Cod. Articolo: 1770607
Cod. Fornitore: 1770607
PHOENIX CONTACT


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Caratteristiche Tecniche
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Caratteristiche Tecniche
Product propertiesProduct line: COMBICON Connectors M
Product type: PCB headers
Product family: MSTBW 2,5/..-G
Number of positions: 3
Pitch: 5.08 mm
Number of connections: 3
Number of rows: 1
Mounting flange: without
Number of potentials: 3
Pin layout: Linear pinning
Solder pins per potential: 1
Electrical propertiesNominal current IN: 12 A
Degree of pollution: 3
MountingMounting type: THR soldering
Pin layout: Linear pinning
Material specificationsMaterial data - contact
Note: WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201
Contact material: Cu alloy
Surface characteristics: Tin-plated
Metal surface contact area (top layer): Tin (5 - 7 µm Sn)
Metal surface contact area (middle layer): Nickel (2 - 3 µm Ni)
Metal surface soldering area (top layer): Tin (5 - 7 µm Sn)
Metal surface soldering area (middle layer): Nickel (2 - 3 µm Ni)
Material data - housing
Color (Housing): black (9005)
Insulating material: PA GF
Insulating material group: IIIa
CTI according to IEC 60112: 250
Flammability rating according to UL 94: V0
NotesNotes on operation: In accordance with IEC 61984, COMBICON connectors have no switching power (COC). During designated use, they must not be plugged in or disconnected when carrying voltage or under load.
DimensionsDimensional drawing: https://dam-mdc.phoenixcontact.com/rendition/156443151564/2464924391ea904289a8463658d8e4b7/-S204x204-FJPG
Pitch: 5.08 mm
Width [w]: 15.24 mm
Height [h]: 15.02 mm
Length [l]: 12 mm
Installed height: 12.42 mm
Solder pin length [P]: 2.6 mm
PCB design
Hole diameter: 1.4 mm
Environmental and real-life conditionsAmbient conditions
Ambient temperature (operation): -40°C ... 100°C (dependent on the derating curve)
Ambient temperature (storage/transport): -40°C ... 70°C
Relative humidity (storage/transport): 30 % ... 70 %
Ambient temperature (assembly): -5°C ... 100°C
Packaging specificationsDimensional drawing: https://dam-mdc.phoenixcontact.com/rendition/156443151564/5c9d0417f989e646afbbef42108ede86/-S204x204-FJPG
Type of packaging: 32 mm wide tape
[W] tape width: 32 mm
[W2] coil overall dimension: 38.4 mm
[A] coil diameter: 330 mm
Outer packaging type: Dry bag
ESD level: (D) electrostatically conductive
Specification: DINÂENÂ61340-5-1 (VDEÂ0300-5-1): 2008-07
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PER SCARICARE I DOCUMENTI E' NECESSARIO EFFETTUARE L'ACCESSO AL SITO

Manufacturer_declaration_05483.pdf

Technical_drawing_24853.pdf

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