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PHOENIX CONTACT 1788547
PHOENIX CONTACTNon disponibile

MC 1,5/ 4-G-3,5 P26 THR - PCB header

PCB headers, nominal cross section: 1.5 mm2, color: black, nominal current: 8 A, rated voltage (III/2): 160 V, contact surface: Tin, contact connection type: Pin, number of potentials: 4, number of rows: 1, number of positions: 4, number of connections: 4, product range: MC 1,5/..-G-THR, pitch: 3.5 mm, mounting: THR soldering, pin layout: Linear pinning, solder pin [P]: 2.6 mm, number of solder pins per potential: 1, plug-in system: COMBICON MC 1,5, Pin connector pattern alignment: Standard, locking: without, mounting: without, type of packaging: packed in cardboard
Cod. Articolo: 1788547
Cod. Fornitore: 1788547
PHOENIX CONTACT


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Caratteristiche Tecniche
Specifiche
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Caratteristiche Tecniche
Product propertiesType: Component suitable for through hole reflow
Product line: COMBICON Connectors S
Product type: PCB headers
Product family: MC 1,5/..-G-THR
Number of positions: 4
Pitch: 3.5 mm
Number of connections: 4
Number of rows: 1
Mounting flange: without
Number of potentials: 4
Pin layout: Linear pinning
Solder pins per potential: 1
Electrical propertiesNominal current IN: 8 A
Nominal voltage UN: 160 V
Degree of pollution: 3
Contact resistance: 1.3 mΩ
Rated voltage (III/3): 160 V
Rated surge voltage (III/3): 2.5 kV
Rated voltage (III/2): 160 V
Rated surge voltage (III/2): 2.5 kV
Rated voltage (II/2): 250 V
Rated surge voltage (II/2): 2.5 kV
MountingMounting type: THR soldering
Pin layout: Linear pinning
Processing notes
Process: Reflow/wave soldering
Moisture Sensitive Level: MSL 1
Classification temperature Tc: 260 °C
Solder cycles in the reflow: 3
Material specificationsMaterial data - contact
Note: WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201
Contact material: Cu alloy
Surface characteristics: Tin-plated
Metal surface contact area (top layer): Tin (3 - 5 µm Sn)
Metal surface contact area (middle layer): Nickel (1 - 3 µm Ni)
Metal surface soldering area (top layer): Tin (3 - 5 µm Sn)
Metal surface soldering area (middle layer): Nickel (1 - 3 µm Ni)
Material data - housing
Color (Housing): black (9005)
Insulating material: LCP
Insulating material group: IIIa
CTI according to IEC 60112: 175
Flammability rating according to UL 94: V0
DimensionsDimensional drawing: https://dam-mdc.phoenixcontact.com/rendition/156443151564/2464924391ea904289a8463658d8e4b7/-S204x204-FJPG
Pitch: 3.5 mm
Width [w]: 15.39 mm
Height [h]: 9.5 mm
Length [l]: 9.2 mm
Installed height: 6.9 mm
Solder pin length [P]: 2.6 mm
Pin dimensions: 0.8 x 0.8 mm
PCB design
Hole diameter: 1.4 mm
Mechanical testsVisual inspection
Specification: IEC60512-1-1:2002-02
Result: Test passed
Dimension check
Specification: IEC60512-1-2:2002-02
Result: Test passed
Resistance of inscriptions
Specification: IEC60068-2-70:1995-12
Result: Test passed
Polarization and coding
Specification: IEC60512-13-5:2006-02
Result: Test passed
Contact holder in insert
Specification: IEC60512-15-1:2008-05
Contact holder in insert
Requirements >20 N: Test passed
Insertion and withdrawal forces
Result: Test passed
No. of cycles: 25
Insertion strength per pos. approx.: 8 N
Withdraw strength per pos. approx.: 5 N
Electrical testsThermal test | Test group C
Specification: IEC60512-5-1:2002-02
Tested number of positions: 20
Insulation resistance
Specification: IEC60512-3-1:2002-02
Insulation resistance, neighboring positions: >5MΩ
Air clearances and creepage distances |
Specification: IEC60664-1:2007-04
Insulating material group: IIIa
Comparative tracking index (IEC60112): CTI 175
Rated insulation voltage (III/3): 160 V
Rated surge voltage (III/3): 2.5 kV
minimum clearance value - non-homogenous field (III/3): 1.5 mm
minimum creepage distance (III/3): 2.5 mm
Rated insulation voltage (III/2): 160 V
Rated surge voltage (III/2): 2.5 kV
minimum clearance value - non-homogenous field (III/2): 1.5 mm
minimum creepage distance (III/2): 1.6 mm
Rated insulation voltage (II/2): 250 V
Rated surge voltage (II/2): 2.5 kV
minimum clearance value - non-homogenous field (II/2): 1.5 mm
minimum creepage distance (II/2): 2.5 mm
Environmental and real-life conditionsVibration test
Specification: IEC60068-2-6:2007-12
Frequency: 10 - 150 - 10 Hz
Sweep speed: 1octave/min
5g (60.1Hz...150Hz)
Amplitude: 0.35mm (10Hz...60.1Hz)
Test duration per axis: 2.5 h
Durability test
Specification: IEC60512-9-1:2010-03
Impulse withstand voltage at sea level: 2.95 kV
Contact resistance R1: 1.3 mΩ
Contact resistance R2: 1.3 mΩ
Insertion/withdrawal cycles: 25
Insulation resistance, neighboring positions: >5MΩ
Climatic test
Specification: ISO6988:1985-02
Corrosive stress: 0.2 dm3 SO2 on 300 dm3/40 °C/1 cycle
Thermal stress: 100°C/168h
Power-frequency withstand voltage: 1.39 kV
Ambient conditions
Ambient temperature (operation): -40 °C ... 100 °C (dependent on the derating curve)
Ambient temperature (storage/transport): -40 °C ... 70 °C
Relative humidity (storage/transport): 30 % ... 70 %
Ambient temperature (assembly): -5 °C ... 100 °C
Packaging specificationsType of packaging: packed in cardboard
Specifiche
ECLASSECLASS-11.0: 27460201
ECLASS-12.0: 27460201
ECLASS-13.0: 27460201
ETIMETIM 9.0: EC002637
UNSPSCUNSPSC 21.0: 39121400
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PER SCARICARE I DOCUMENTI E' NECESSARIO EFFETTUARE L'ACCESSO AL SITO

Approvals_00093.pdf

Approvals_00385.pdf

Approvals_01920.pdf

Manufacturer_declaration_05483.pdf

Technical_drawing_26016.pdf

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