1823874 PHOENIX CONTACT - Technology Bsa

SPT-THR 1,5/ 4-H-5,0 P20 R32 - PCB terminal block

PCB terminal block, nominal current: 17.5 A, rated voltage (III/2): 320 V, nominal cross section: 1.5 mm², number of potentials: 4, number of rows: 1, number of positions per row: 4, product range: SPT 1,5/..-H-THR, pitch: 5 mm, connection method: Push-in spring connection, mounting: THR soldering, conductor/PCB connection direction: 0 °, color: black, Pin layout: Linear pinning, Solder pin [P]: 2 mm, number of solder pins per potential: 2, type of packaging: 32 mm wide tape. Suitable for CAT5

Cod. Articolo: 1823874

Cod. Fornitore: 1823874

PHOENIX CONTACT

Product properties	Product line: COMBICON Terminals S Product type: Printed circuit board terminal Product family: SPT 1,5/..-H-THR Number of positions: 4 Pitch: 5 mm Number of connections: 4 Number of rows: 1 Number of potentials: 4 Pin layout: Linear pinning Solder pins per potential: 2
Electrical properties	Nominal current I_N: 17.5 A Nominal voltage U_N: 320 V Degree of pollution: 3 Rated voltage (III/3): 250 V Rated surge voltage (III/3): 4 kV Rated voltage (III/2): 320 V Rated surge voltage (III/2): 4 kV Rated voltage (II/2): 500 V Rated surge voltage (II/2): 4 kV
Connection data	Connection technology Nominal cross section: 1.5 mm² Conductor connection Connection method: Push-in spring connection Conductor cross section rigid: 0.2 mm² ... 1.5 mm² Conductor cross section flexible: 0.2 mm² ... 1.5 mm² Conductor cross section AWG: 24 ... 16 Conductor cross section flexible, with ferrule without plastic sleeve: 0.2 mm² ... 1.5 mm² Conductor cross section, flexible, with ferrule, with plastic sleeve: 0.2 mm² ... 0.75 mm² Stripping length: 8 mm
Mounting	Mounting type: THR soldering Pin layout: Linear pinning Connection method: Push-in spring connection Processing notes Process: Reflow/wave soldering Moisture Sensitive Level: MSL 1 Classification temperature T_c: 260°C Solder cycles in the reflow: 3
Material specifications	Material data - contact Note: WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201 Contact material: Cu alloy Surface characteristics: hot-dip tin-plated Metal surface terminal point (top layer): Tin (4 - 8 µm Sn) Metal surface soldering area (top layer): Tin (4 - 8 µm Sn) Material data - housing Color (Housing): black (9005) Insulating material: LCP Insulating material group: IIIa CTI according to IEC 60112: 175 Flammability rating according to UL 94: V0 Material data Ã¢ actuating element Color (Actuating element): white (9010) Insulating material: PA GF Insulating material group: I CTI according to IEC 60112: 600 Flammability rating according to UL 94: V0
Notes	General: The item is qualified for CAT5 Ethernet applications. For this reason, it is suited for use in IoT devices. This item is not suitable for PCB cleaning with liquids.
Dimensions	Dimensional drawing: https://dam-mdc.phoenixcontact.com/rendition/156443151564/158b0afe23d1ab408f646eacfe25f655/-S204x204-FJPG Pitch: 5 mm Width [w]: 19 mm Height [h]: 9.7 mm Length [l]: 13.6 mm Installed height: 7.7 mm Solder pin length [P]: 2 mm Pin dimensions: 0.7 x 0.3 mm PCB design Pin spacing: 7 mm Hole diameter: 1.1 mm
Mechanical tests	Connection test Specification: IEC 60998-2-2:2002-12 Result: Test passed Test for conductor damage and slackening Specification: IEC 60998-2-2:2002-12 Result: Test passed Pull-out test Specification: IEC 60998-2-2:2002-12 Conductor cross section/conductor type/tractive force setpoint/actual value: 0.2 mm² / solid / > 10 N 0.2 mm² / flexible / > 10 N 1.5 mm² / solid / > 40 N 1.5 mm² / flexible / > 40 N Flexion test Specification: IEC 60998-2-2:2002-12 Result: Test passed Insulation holder for crimp connections Result: Test passed
Electrical tests	Temperature-rise test Specification: IEC 60947-7-4:2019-01 Requirement temperature-rise test: The sum of ambient temperature and temperature rise of the PCB terminal block shall not exceed the upper limiting temperature. Insulation resistance Specification: IEC 60998-1:2002-12 Insulation resistance, neighboring positions: >5MÃ© Air clearances and creepage distances \| Specification: IEC 60947-7-4:2013-08 Insulating material group: IIIa Comparative tracking index (IEC 60112): CTI 175 Rated insulation voltage (III/3): 250 V Rated surge voltage (III/3): 4 kV minimum clearance value - non-homogenous field (III/3): 3 mm minimum creepage distance (III/3): 4 mm Rated insulation voltage (III/2): 320 V Rated surge voltage (III/2): 4 kV minimum clearance value - non-homogenous field (III/2): 3 mm minimum creepage distance (III/2): 3.2 mm Rated insulation voltage (II/2): 500 V Rated surge voltage (II/2): 4 kV minimum clearance value - non-homogenous field (II/2): 3 mm minimum creepage distance (II/2): 5 mm
Environmental and real-life conditions	Vibration test Specification: IEC 60068-2-6:2007-12 Frequency: 10 - 150 - 10 Hz Sweep speed: 1octave/min 5g (60.1Hz...150Hz) Amplitude: 0.35mm (10Hz...60.1Hz) Test duration per axis: 2.5 h Glow-wire test Specification: IEC 60998-1:2002-12 Temperature: 850°C Time of exposure: 5 s Ambient conditions Ambient temperature (operation): -40°C ... 105°C (Depending on the current carrying capacity/derating curve) Ambient temperature (storage/transport): -40°C ... 70°C Relative humidity (storage/transport): 30 % ... 70 % Ambient temperature (assembly): -5°C ... 100°C
Packaging specifications	Dimensional drawing: https://dam-mdc.phoenixcontact.com/rendition/156443151564/5c9d0417f989e646afbbef42108ede86/-S204x204-FJPG Type of packaging: 32 mm wide tape [W] tape width: 32 mm [W2] coil overall dimension: 38.4 mm [A] coil diameter: 330 mm Outer packaging type: Transparent-Bag ESD level: (D) electrostatically conductive Specification: DINEN61340-5-1 (VDE0300-5-1): 2008-07