1824556 PHOENIX CONTACT - Technology Bsa

SPT-SMD 1,5/ 5-H-3,5 R44 - PCB terminal block

PCB terminal block, nominal current: 17.5 A, rated voltage (III/2): 160 V, nominal cross section: 1.5 mm², number of potentials: 5, number of rows: 1, number of positions per row: 5, product range: SPT 1,5/..-H-SMD, pitch: 3.5 mm, connection method: Push-in spring connection, mounting: SMD soldering, conductor/PCB connection direction: 0 °, color: black, Pin layout: Linear pad geometry, Solder pin [P]: 2 mm, number of solder pins per potential: 1, type of packaging: 44 mm wide tape

Cod. Articolo: 1824556

Cod. Fornitore: 1824556

PHOENIX CONTACT

Product properties	Product line: COMBICON Terminals S Product type: Printed circuit board terminal Product family: SPT 1,5/..-H-SMD Number of positions: 5 Pitch: 3.5 mm Number of connections: 5 Number of rows: 1 Number of potentials: 5 Pin layout: Linear pad geometry Solder pins per potential: 1
Electrical properties	Nominal current I_N: 17.5 A Nominal voltage U_N: 160 V Degree of pollution: 3 Rated voltage (III/3): 160 V Rated surge voltage (III/3): 2.5 kV Rated voltage (III/2): 160 V Rated surge voltage (III/2): 2.5 kV Rated voltage (II/2): 320 V Rated surge voltage (II/2): 2.5 kV
Connection data	Connection technology Nominal cross section: 1.5 mm² Conductor connection Connection method: Push-in spring connection Conductor cross section rigid: 0.2 mm² ... 1.5 mm² Conductor cross section flexible: 0.2 mm² ... 1.5 mm² Conductor cross section AWG: 24 ... 16 Conductor cross section flexible, with ferrule without plastic sleeve: 0.2 mm² ... 1.5 mm² Conductor cross section, flexible, with ferrule, with plastic sleeve: 0.2 mm² ... 0.75 mm² Stripping length: 8 mm
Mounting	Mounting type: SMD soldering Pin layout: Linear pad geometry Connection method: Push-in spring connection Processing notes Process: Reflow soldering Moisture Sensitive Level: MSL 1 Classification temperature T_c: 260°C Solder cycles in the reflow: 3
Material specifications	Material data - contact Note: WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201 Contact material: Cu alloy Surface characteristics: hot-dip tin-plated Metal surface terminal point (top layer): Tin (4 - 8 µm Sn) Metal surface soldering area (top layer): Tin (4 - 8 µm Sn) Material data - housing Color (Housing): black (9005) Insulating material: LCP Insulating material group: IIIa CTI according to IEC 60112: 175 Flammability rating according to UL 94: V0 Material data Ã¢ actuating element Color (Actuating element): white (9010) Insulating material: PA GF Insulating material group: I CTI according to IEC 60112: 600 Flammability rating according to UL 94: V0
Notes	Notes on operation: The solder anchors on the outer poles reduce the mechanical strain on the SMD soldering spots. Assembly instruction:: This item is not suitable for PCB cleaning with liquids.
Dimensions	Dimensional drawing: https://dam-mdc.phoenixcontact.com/rendition/156443151564/158b0afe23d1ab408f646eacfe25f655/-S204x204-FJPG Pitch: 3.5 mm Width [w]: 18 mm Height [h]: 9.7 mm Length [l]: 13.6 mm Installed height: 7.7 mm Solder pin length [P]: 2 mm Pin dimensions: 0.7 x 0.3 mm PCB design Pad geometry: 1.6 x 4 mm Pin spacing: 7 mm Hole diameter: 1.1 mm
Mechanical tests	Connection test Specification: IEC 60998-2-2:2002-12 Result: Test passed Test for conductor damage and slackening Specification: IEC 60998-2-2:2002-12 Result: Test passed Pull-out test Specification: IEC 60998-2-2:2002-12 Conductor cross section/conductor type/tractive force setpoint/actual value: 0.2 mm² / solid / > 10 N 0.2 mm² / flexible / > 10 N 1.5 mm² / solid / > 40 N 1.5 mm² / flexible / > 40 N Flexion test Specification: IEC 60998-2-2:2002-12 Result: Test passed Insulation holder for crimp connections Result: Test passed
Electrical tests	Temperature-rise test Specification: IEC 60947-7-4:2019-01 Requirement temperature-rise test: The sum of ambient temperature and temperature rise of the PCB terminal block shall not exceed the upper limiting temperature. Insulation resistance Specification: IEC 60998-1:2002-12 Insulation resistance, neighboring positions: >5MÃ© Air clearances and creepage distances \| Specification: IEC 60664-1:2007-04 Insulating material group: IIIa Comparative tracking index (IEC 60112): CTI 175 Rated insulation voltage (III/3): 160 V Rated surge voltage (III/3): 2.5 kV minimum clearance value - non-homogenous field (III/3): 1.5 mm minimum creepage distance (III/3): 2.5 mm Rated insulation voltage (III/2): 160 V Rated surge voltage (III/2): 2.5 kV minimum clearance value - non-homogenous field (III/2): 1.5 mm minimum creepage distance (III/2): 1.6 mm Rated insulation voltage (II/2): 320 V Rated surge voltage (II/2): 2.5 kV minimum clearance value - non-homogenous field (II/2): 1.5 mm minimum creepage distance (II/2): 3.2 mm
Environmental and real-life conditions	Vibration test Specification: IEC 60068-2-6:2007-12 Frequency: 10 - 150 - 10 Hz Sweep speed: 1octave/min 5g (60.1Hz...150Hz) Amplitude: 0.35mm (10Hz...60.1Hz) Test duration per axis: 2.5 h Glow-wire test Specification: IEC 60998-1:2002-12 Temperature: 850°C Time of exposure: 5 s Ambient conditions Ambient temperature (operation): -40°C ... 105°C (Depending on the current carrying capacity/derating curve) Ambient temperature (storage/transport): -40°C ... 70°C Relative humidity (storage/transport): 30 % ... 70 % Ambient temperature (assembly): -5°C ... 100°C
Packaging specifications	Dimensional drawing: https://dam-mdc.phoenixcontact.com/rendition/156443151564/5c9d0417f989e646afbbef42108ede86/-S204x204-FJPG Type of packaging: 44 mm wide tape [W] tape width: 44 mm [W2] coil overall dimension: 50.4 mm [A] coil diameter: 330 mm Outer packaging type: Transparent-Bag ESD level: (D) electrostatically conductive Specification: DINEN61340-5-1 (VDE0300-5-1): 2008-07