1827605 PHOENIX CONTACT - Technology Bsa

CC 2,5/21-GF-5,08-LR P26THR - PCB header

PCB headers, nominal cross section: 2.5 mm², color: black, nominal current: 12 A, rated voltage (III/2): 320 V, contact surface: Tin, contact connection type: Pin, number of potentials: 21, number of rows: 1, number of positions: 21, number of connections: 21, product range: CC 2,5/..-GF-LR, pitch: 5.08 mm, mounting: THR soldering, pin layout: Linear pinning, solder pin [P]: 2.6 mm, number of solder pins per potential: 1, plug-in system: COMBICON MSTB 2,5, Pin connector pattern alignment: Standard, locking: Snap-in locking, mounting: Lock & release threaded flange, type of packaging: packed in cardboard

Cod. Articolo: 1827605

Cod. Fornitore: 1827605

PHOENIX CONTACT

Product properties	Type: Component suitable for through hole reflow Product line: COMBICON Connectors M Product type: PCB headers Product family: CC 2,5/..-GF-LR Number of positions: 21 Pitch: 5.08 mm Number of connections: 21 Number of rows: 1 Mounting flange: Lock & release threaded flange Number of potentials: 21 Pin layout: Linear pinning Solder pins per potential: 1
Electrical properties	Nominal current I_N: 12 A Nominal voltage U_N: 320 V Degree of pollution: 3 Contact resistance: 1.1 mÃ© Rated voltage (III/3): 250 V Rated surge voltage (III/3): 4 kV Rated voltage (III/2): 320 V Rated surge voltage (III/2): 4 kV Rated voltage (II/2): 400 V Rated surge voltage (II/2): 4 kV
Mounting	Mounting type: THR soldering Pin layout: Linear pinning Flange Tightening torque: 0.3 Nm Processing notes Moisture Sensitive Level: MSL 1 Classification temperature T_c: 260°C Solder cycles in the reflow: 3
Material specifications	Material data - contact Note: WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201 Contact material: Cu alloy Surface characteristics: Tin-plated Metal surface contact area (top layer): Tin (3 - 5 Ãµm Sn) Metal surface contact area (middle layer): Nickel (1.3 - 3 Ãµm Ni) Metal surface soldering area (top layer): Tin (3 - 5 Ãµm Sn) Metal surface soldering area (middle layer): Nickel (1.3 - 3 Ãµm Ni) Material data - housing Color (Housing): black (9005) Insulating material: LCP Insulating material group: IIIa CTI according to IEC 60112: 175 Flammability rating according to UL 94: V0
Notes	Details for soldering processes: Processing using reflow processes in compliance with IEC 60068-2-58 or DIN EN 61760-1 (latest version) Moisture Sensitive Level (MSL) = 1 according to IPC/JEDEC J-STD-020-C Notes on operation: In accordance with IEC 61984, COMBICON connectors have no switching power (COC). During designated use, they must not be plugged in or disconnected when carrying voltage or under load.
Dimensions	Dimensional drawing: https://dam-mdc.phoenixcontact.com/rendition/156443151564/2464924391ea904289a8463658d8e4b7/-S204x204-FJPG Pitch: 5.08 mm Width [w]: 116.79 mm Height [h]: 11.17 mm Length [l]: 12 mm Installed height: 8.57 mm Solder pin length [P]: 2.6 mm Pin dimensions: 1 x 1 mm PCB design Hole diameter: 1.6 mm
Mechanical tests	Visual inspection Specification: IEC 60512-1-1:2002-02 Result: Test passed Dimension check Specification: IEC 60512-1-2:2002-02 Result: Test passed Resistance of inscriptions Specification: IEC 60068-2-70:1995-12 Result: Test passed Polarization and coding Specification: IEC 60512-13-5:2006-02 Result: Test passed Contact holder in insert Specification: IEC 60512-15-1:2008-05 Contact holder in insert Requirements >20 N: Test passed Insertion and withdrawal forces Result: Test passed No. of cycles: 25 Insertion strength per pos. approx.: 12 N Withdraw strength per pos. approx.: 9 N
Electrical tests	Thermal test \| Test group C Specification: IEC 60512-5-1:2002-02 Tested number of positions: 12 Insulation resistance Specification: IEC 60512-3-1:2002-02 Insulation resistance, neighboring positions: >Ã5ÃMÃ© Air clearances and creepage distances \| Specification: IEC 60664-1:2007-04 Insulating material group: IIIa Comparative tracking index (IEC 60112): CTI 175 Rated insulation voltage (III/3): 250 V Rated surge voltage (III/3): 4 kV minimum clearance value - non-homogenous field (III/3): 3 mm minimum creepage distance (III/3): 4 mm Rated insulation voltage (III/2): 320 V Rated surge voltage (III/2): 4 kV minimum clearance value - non-homogenous field (III/2): 3 mm minimum creepage distance (III/2): 3.2 mm Rated insulation voltage (II/2): 400 V Rated surge voltage (II/2): 4 kV minimum clearance value - non-homogenous field (II/2): 3 mm minimum creepage distance (II/2): 4 mm
Environmental and real-life conditions	Vibration test Specification: IEC 60068-2-6:2007-12 Frequency: 10 - 150 - 10 Hz Sweep speed: 1Ãoctave/min 5g (60.1ÃHzÃ...Ã150ÃHz) Amplitude: 0.35Ãmm (10ÃHzÃ...Ã60.1ÃHz) Test duration per axis: 2.5 h Durability test Specification: IEC 60512-9-1:2010-03 Impulse withstand voltage at sea level: 4.8 kV Contact resistance R₁: 1.1 mÃ© Contact resistance R₂: 1.2 mÃ© Insertion/withdrawal cycles: 25 Insulation resistance, neighboring positions: >Ã5ÃMÃ© Climatic test Specification: ISOÃ6988:1985-02 Corrosive stress: 0.2 dm³SO₂on 300 dm³/40°C/1 cycle Thermal stress: 105Ã°C/168Ãh Power-frequency withstand voltage: 2.21 kV Shocks Specification: IEC 60068-2-27:2008-02 Pulse shape: Semi-sinusoidal Acceleration: 30g Shock duration: 18Ãms Test directions: X-, Y- and Z-axis (pos. and neg.) Ambient conditions Ambient temperature (operation): -40°C ... 105°C (dependent on the derating curve) Ambient temperature (storage/transport): -40°C ... 70°C Relative humidity (storage/transport): 30 % ... 70 % Ambient temperature (assembly): -5°C ... 100°C
Packaging specifications	Type of packaging: packed in cardboard