1832577 PHOENIX CONTACT - Technology Bsa

MCDNV 1,5/11-G1-3,5 RNP26THRAU - PCB header

PCB headers, nominal cross section: 1.5 mm², color: black, nominal current: 8 A, rated voltage (III/2): 160 V, contact surface: Gold, contact connection type: Pin, number of potentials: 22, number of rows: 2, number of positions: 11, number of connections: 22, product range: MCDNV 1,5/..-G1-RN-THR, pitch: 3.5 mm, mounting: THR soldering, pin layout: Linear pinning, solder pin [P]: 2.6 mm, number of solder pins per potential: 1, plug-in system: COMBICON MC 1,5, Pin connector pattern alignment: Standard, locking: Snap-in locking, mounting: Engagement nose, type of packaging: packed in cardboard

Cod. Articolo: 1832577

Cod. Fornitore: 1832577

PHOENIX CONTACT

Product properties	Product line: COMBICON Connectors S Product type: PCB headers Product family: MCDNV 1,5/..-G1-RN-THR Number of positions: 11 Pitch: 3.5 mm Number of connections: 22 Number of rows: 2 Mounting flange: Engagement nose Number of potentials: 22 Pin layout: Linear pinning Solder pins per potential: 1
Electrical properties	Nominal current I_N: 8 A Nominal voltage U_N: 160 V Degree of pollution: 3 Rated voltage (III/3): 160 V Rated surge voltage (III/3): 2.5 kV Rated voltage (III/2): 160 V Rated surge voltage (III/2): 2.5 kV Rated voltage (II/2): 250 V Rated surge voltage (II/2): 2.5 kV
Mounting	Mounting type: THR soldering Pin layout: Linear pinning
Material specifications	Material data - contact Note: WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201 Contact material: Cu alloy Surface characteristics: Completely gold-plated Metal surface contact area (top layer): Gold (0.8 - 1.4 µm Au) Metal surface contact area (middle layer): Nickel (1 - 3 µm Ni) Metal surface soldering area (top layer): Gold (0.8 - 1.4 µm Au) Metal surface soldering area (middle layer): Nickel (1 - 3 µm Ni) Material data - housing Color (Housing): black (9005) Insulating material: LCP Insulating material group: IIIa CTI according to IEC 60112: 175 Flammability rating according to UL 94: V0
Dimensions	Dimensional drawing: https://dam-mdc.phoenixcontact.com/rendition/156443151564/70e0f23c282363459709fcfe7d5e7131/-S204x204-FJPG Pitch: 3.5 mm Width [w]: 42.2 mm Height [h]: 15.9 mm Length [l]: 15.2 mm Installed height: 13.3 mm Solder pin length [P]: 2.6 mm PCB design Hole diameter: 1.4 mm
Electrical tests	Air clearances and creepage distances \| Specification: IEC60664-1:2007-04 Insulating material group: IIIa Comparative tracking index (IEC60112): CTI 175 Rated insulation voltage (III/3): 160 V Rated surge voltage (III/3): 2.5 kV minimum clearance value - non-homogenous field (III/3): 1.5 mm minimum creepage distance (III/3): 2.5 mm Rated insulation voltage (III/2): 160 V Rated surge voltage (III/2): 2.5 kV minimum clearance value - non-homogenous field (III/2): 1.5 mm minimum creepage distance (III/2): 1.6 mm Rated insulation voltage (II/2): 250 V Rated surge voltage (II/2): 2.5 kV minimum clearance value - non-homogenous field (II/2): 1.5 mm minimum creepage distance (II/2): 2.5 mm
Environmental and real-life conditions	Ambient conditions Ambient temperature (operation): -40 °C ... 100 °C (dependent on the derating curve) Ambient temperature (storage/transport): -40 °C ... 70 °C Relative humidity (storage/transport): 30 % ... 70 % Ambient temperature (assembly): -5 °C ... 100 °C
Packaging specifications	Type of packaging: packed in cardboard