1952872 PHOENIX CONTACT - Technology Bsa

MCDNV 1,5/11-G1-3,5 P26THR - PCB header

PCB headers, nominal cross section: 1.5 mm², color: black, nominal current: 8 A, rated voltage (III/2): 160 V, contact surface: Tin, contact connection type: Pin, number of potentials: 22, number of rows: 2, number of positions: 11, number of connections: 22, product range: MCDNV 1,5/..-G1-THR, pitch: 3.5 mm, mounting: THR soldering, pin layout: Linear pinning, solder pin [P]: 2.6 mm, number of solder pins per potential: 1, plug-in system: COMBICON MC 1,5, Pin connector pattern alignment: Standard, locking: without, mounting: without, type of packaging: packed in cardboard, The pin length is 26 mm. User information and design recommendations on Through Hole Reflow Technology can be found at: http: "Downloads".

Cod. Articolo: 1952872

Cod. Fornitore: 1952872

PHOENIX CONTACT

Product properties	Type: Component suitable for through hole reflow Product line: COMBICON Connectors S Product type: PCB headers Product family: MCDNV 1,5/..-G1-THR Number of positions: 11 Pitch: 3.5 mm Number of connections: 22 Number of rows: 2 Mounting flange: without Number of potentials: 22 Pin layout: Linear pinning Solder pins per potential: 1
Electrical properties	Nominal current I_N: 8 A Nominal voltage U_N: 160 V Degree of pollution: 3 Contact resistance: 1.8 mÃ© Rated voltage (III/3): 160 V Rated surge voltage (III/3): 2.5 kV Rated voltage (III/2): 160 V Rated surge voltage (III/2): 2.5 kV Rated voltage (II/2): 250 V Rated surge voltage (II/2): 2.5 kV
Mounting	Mounting type: THR soldering Pin layout: Linear pinning Processing notes Process: Reflow/wave soldering Moisture Sensitive Level: MSL 1 Classification temperature T_c: 260 °C Solder cycles in the reflow: 3
Material specifications	Material data - contact Note: WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201 Contact material: Cu alloy Surface characteristics: Tin-plated Metal surface contact area (top layer): Tin (3 - 5 µm Sn) Metal surface contact area (middle layer): Nickel (1.3 - 3 µm Ni) Metal surface soldering area (top layer): Tin (3 - 5 µm Sn) Metal surface soldering area (middle layer): Nickel (1.3 - 3 µm Ni) Material data - housing Color (Housing): black (9005) Insulating material: LCP Insulating material group: IIIa CTI according to IEC 60112: 175 Flammability rating according to UL 94: V0
Notes	General: Processing using reflow processes in compliance with IEC 60068-2-58 or DIN EN 61760-1 (latest version) Moisture Sensitive Level (MSL) = 1 according to IPC/JEDEC J-STD-020-C
Dimensions	Dimensional drawing: https://dam-mdc.phoenixcontact.com/rendition/156443151564/70e0f23c282363459709fcfe7d5e7131/-S204x204-FJPG Pitch: 3.5 mm Width [w]: 40 mm Height [h]: 13.3 mm Length [l]: 16 mm Installed height: 16 mm Solder pin length [P]: 2.6 mm Pin dimensions: 0.8 x 0.8 mm PCB design Pin spacing: 3.50 mm Hole diameter: 1.4 mm
Mechanical tests	Visual inspection Specification: IEC60512-1-1:2002-02 Result: Test passed Dimension check Specification: IEC60512-1-2:2002-02 Result: Test passed Resistance of inscriptions Specification: IEC60068-2-70:1995-12 Result: Test passed Polarization and coding Specification: IEC60512-13-5:2006-02 Result: Test passed Contact holder in insert Specification: IEC60512-15-1:2008-05 Contact holder in insert Requirements >20 N: Test passed Insertion and withdrawal forces Result: Test passed No. of cycles: 25 Insertion strength per pos. approx.: 8 N Withdraw strength per pos. approx.: 6 N
Electrical tests	Thermal test \| Test group C Specification: IEC60512-5-1:2002-02 Tested number of positions: 20 Insulation resistance Specification: IEC60512-3-1:2002-02 Insulation resistance, neighboring positions: >5MÃ© Air clearances and creepage distances \| Specification: IEC60664-1:2007-04 Insulating material group: IIIa Comparative tracking index (IEC60112): CTI 175 Rated insulation voltage (III/3): 160 V Rated surge voltage (III/3): 2.5 kV minimum clearance value - non-homogenous field (III/3): 1.5 mm minimum creepage distance (III/3): 2.5 mm Rated insulation voltage (III/2): 160 V Rated surge voltage (III/2): 2.5 kV minimum clearance value - non-homogenous field (III/2): 1.5 mm minimum creepage distance (III/2): 1.6 mm Rated insulation voltage (II/2): 250 V Rated surge voltage (II/2): 2.5 kV minimum clearance value - non-homogenous field (II/2): 1.5 mm minimum creepage distance (II/2): 2.5 mm
Environmental and real-life conditions	Vibration test Specification: IEC60068-2-6:2007-12 Frequency: 10 - 150 - 10 Hz Sweep speed: 1octave/min 5g (60.1Hz...150Hz) Amplitude: 0.35mm (10Hz...60.1Hz) Test duration per axis: 2.5 h Durability test Specification: IEC60512-9-1:2010-03 Impulse withstand voltage at sea level: 2.95 kV Contact resistance R₁: 1.8 mÃ© Contact resistance R₂: 1.9 mÃ© Insertion/withdrawal cycles: 25 Insulation resistance, neighboring positions: >5MÃ© Climatic test Specification: ISO6988:1985-02 Corrosive stress: 0.2 dm³SO₂on 300 dm³/40 °C/1 cycle Thermal stress: 100°C/168h Power-frequency withstand voltage: 1.39 kV Ambient conditions Ambient temperature (operation): -40 °C ... 100 °C (dependent on the derating curve) Ambient temperature (storage/transport): -40 °C ... 70 °C Relative humidity (storage/transport): 30 % ... 70 % Ambient temperature (assembly): -5 °C ... 100 °C
Packaging specifications	Type of packaging: packed in cardboard