1955002 PHOENIX CONTACT - Technology Bsa

CCA 2,5/10-G-5,08 P26THR - PCB header

PCB headers, nominal cross section: 2.5 mm², color: black, nominal current: 12 A, rated voltage (III/2): 320 V, contact surface: Tin, contact connection type: Pin, number of potentials: 10, number of rows: 1, number of positions: 10, number of connections: 10, product range: CCA 2,5/..-G, pitch: 5.08 mm, connection method: Plug-in connection, mounting: THR soldering, pin layout: Linear pinning, solder pin [P]: 2.6 mm, number of solder pins per potential: 1, plug-in system: COMBICON MSTB 2,5, Pin connector pattern alignment: Standard, locking: without, mounting: without, type of packaging: packed in cardboard, For user information and design recommendations for through-hole reflow technology, go to: Downloads

Cod. Articolo: 1955002

Cod. Fornitore: 1955002

PHOENIX CONTACT

Product properties	Type: Component suitable for through hole reflow Product line: COMBICON Connectors M Product type: PCB headers Product family: CCA 2,5/..-G Number of positions: 10 Pitch: 5.08 mm Number of connections: 10 Number of rows: 1 Mounting flange: without Number of potentials: 10 Pin layout: Linear pinning Solder pins per potential: 1
Electrical properties	Nominal current I_N: 12 A Nominal voltage U_N: 320 V Degree of pollution: 3 Contact resistance: 1.3 mÃ© Rated voltage (III/3): 250 V Rated surge voltage (III/3): 4 kV Rated voltage (III/2): 320 V Rated surge voltage (III/2): 4 kV Rated voltage (II/2): 400 V Rated surge voltage (II/2): 4 kV
Mounting	Mounting type: THR soldering Pin layout: Linear pinning Processing notes Process: Reflow/wave soldering Moisture Sensitive Level: MSL 1 Classification temperature T_c: 260°C Solder cycles in the reflow: 3
Material specifications	Material data - contact Note: WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201 Contact material: Cu alloy Surface characteristics: Tin-plated Metal surface contact area (top layer): Tin (3 - 5 µm Sn) Metal surface contact area (middle layer): Nickel (1.3 - 3 µm Ni) Metal surface soldering area (top layer): Tin (3 - 5 µm Sn) Metal surface soldering area (middle layer): Nickel (1.3 - 3 µm Ni) Material data - housing Color (Housing): black (9005) Insulating material: LCP Insulating material group: IIIa CTI according to IEC 60112: 175 Flammability rating according to UL 94: V0
Notes	General: Processing using reflow processes in compliance with IEC 60068-2-58 or DIN EN 61760-1 (latest version) Moisture Sensitive Level (MSL) = 1 according to IPC/JEDEC J-STD-020-C
Dimensions	Dimensional drawing: https://dam-mdc.phoenixcontact.com/rendition/156443151564/2464924391ea904289a8463658d8e4b7/-S204x204-FJPG Pitch: 5.08 mm Width [w]: 53.6 mm Height [h]: 11.17 mm Length [l]: 12 mm Installed height: 8.57 mm Solder pin length [P]: 2.6 mm Pin dimensions: 1 x 1 mm PCB design Hole diameter: 1.6 mm
Mechanical tests	Visual inspection Specification: IEC 60512-1-1:2002-02 Result: Test passed Dimension check Specification: IEC 60512-1-2:2002-02 Result: Test passed Resistance of inscriptions Specification: IEC 60068-2-70:1995-12 Result: Test passed Polarization and coding Specification: IEC 60512-13-5:2006-02 Result: Test passed Contact holder in insert Specification: IEC 60512-15-1:2008-05 Contact holder in insert Requirements >20 N: Test passed Insertion and withdrawal forces Result: Test passed No. of cycles: 25 Insertion strength per pos. approx.: 8 N Withdraw strength per pos. approx.: 6 N
Electrical tests	Thermal test \| Test group C Specification: IEC 60512-5-1:2002-02 Tested number of positions: 12 Insulation resistance Specification: IEC 60512-3-1:2002-02 Insulation resistance, neighboring positions: >5MÃ© Air clearances and creepage distances \| Specification: IEC 60664-1:2007-04 Insulating material group: IIIa Comparative tracking index (IEC 60112): CTI 175 Rated insulation voltage (III/3): 250 V Rated surge voltage (III/3): 4 kV minimum clearance value - non-homogenous field (III/3): 3 mm minimum creepage distance (III/3): 4 mm Rated insulation voltage (III/2): 320 V Rated surge voltage (III/2): 4 kV minimum clearance value - non-homogenous field (III/2): 3 mm minimum creepage distance (III/2): 3.2 mm Rated insulation voltage (II/2): 400 V Rated surge voltage (II/2): 4 kV minimum clearance value - non-homogenous field (II/2): 3 mm minimum creepage distance (II/2): 4 mm
Environmental and real-life conditions	Vibration test Specification: IEC 60068-2-6:2007-12 Frequency: 10 - 150 - 10 Hz Sweep speed: 1octave/min 5g (60.1Hz...150Hz) Amplitude: 0.35mm (10Hz...60.1Hz) Test duration per axis: 2.5 h Durability test Specification: IEC 60512-9-1:2010-03 Impulse withstand voltage at sea level: 4.8 kV Contact resistance R₁: 1.3 mÃ© Contact resistance R₂: 1.3 mÃ© Insertion/withdrawal cycles: 25 Insulation resistance, neighboring positions: >5MÃ© Climatic test Specification: ISO6988:1985-02 Corrosive stress: 0.2 dm³SO₂on 300 dm³/40°C/1 cycle Thermal stress: 100°C/168h Power-frequency withstand voltage: 2.21 kV Ambient conditions Ambient temperature (operation): -40°C ... 100°C (dependent on the derating curve) Ambient temperature (storage/transport): -40°C ... 70°C Relative humidity (storage/transport): 30 % ... 70 % Ambient temperature (assembly): -5°C ... 100°C
Packaging specifications	Type of packaging: packed in cardboard