1963049 PHOENIX CONTACT - Technology Bsa

MCV 1,5/ 6-GFL-3,5 THT - PCB header

PCB headers, nominal cross section: 1.5 mm², color: black, nominal current: 8 A, rated voltage (III/2): 160 V, contact surface: Tin, contact connection type: Pin, number of potentials: 6, number of rows: 1, number of positions: 6, number of connections: 6, product range: MCV 1,5/..-GFL-THT, pitch: 3.5 mm, mounting: THR soldering, pin layout: Linear pinning, solder pin [P]: 2.6 mm, number of solder pins per potential: 1, plug-in system: COMBICON MC 1,5, Pin connector pattern alignment: Standard, locking: Screw locking mechanism, mounting: Threaded flange, type of packaging: packed in cardboard, Two-in-one â Pin strips must always be made up of a left (L) and a right (R) segment. Please allow for the corresponding counterpart from the accessories to complete the THR pin strip. User information and design recommendations on Through Hole Reflow Technology can be found at: "Downloads".

Cod. Articolo: 1963049

Cod. Fornitore: 1963049

PHOENIX CONTACT

Product properties	Type: Component suitable for through hole reflow Product line: COMBICON Connectors S Product type: PCB headers Product family: MCV 1,5/..-GFL-THT Number of positions: 6 Pitch: 3.5 mm Number of connections: 6 Number of rows: 1 Mounting flange: Threaded flange Number of potentials: 6 Pin layout: Linear pinning Solder pins per potential: 1
Electrical properties	Nominal current I_N: 8 A Nominal voltage U_N: 160 V Degree of pollution: 3 Rated voltage (III/3): 160 V Rated surge voltage (III/3): 2.5 kV Rated voltage (III/2): 160 V Rated surge voltage (III/2): 2.5 kV Rated voltage (II/2): 250 V Rated surge voltage (II/2): 2.5 kV
Mounting	Mounting type: THR soldering Pin layout: Linear pinning Flange Tightening torque: 0.3 Nm
Material specifications	Material data - contact Note: WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201 Contact material: Cu alloy Surface characteristics: Tin-plated Metal surface contact area (top layer): Tin (3 - 5 µm Sn) Metal surface contact area (middle layer): Nickel (1.3 - 3 µm Ni) Metal surface soldering area (top layer): Tin (3 - 5 µm Sn) Metal surface soldering area (middle layer): Nickel (1.3 - 3 µm Ni) Material data - housing Color (Housing): black (9005) Insulating material: PA Insulating material group: IIIa CTI according to IEC 60112: 250 Flammability rating according to UL 94: V0 Glow wire flammability index GWFI according to EN60695-2-12: 850 Glow wire ignition temperature GWIT according to EN60695-2-13: 775 Temperature for the ball pressure test according to EN60695-10-2: 125°C
Dimensions	Dimensional drawing: https://dam-mdc.phoenixcontact.com/rendition/156443151564/70e0f23c282363459709fcfe7d5e7131/-S204x204-FJPG Pitch: 3.5 mm Height [h]: 12.6 mm Length [l]: 7.25 mm Installed height: 10 mm Solder pin length [P]: 2.6 mm Pin dimensions: 0.8 x 0.8 mm PCB design Pin spacing: 3.50 mm Hole diameter: 1.3 mm
Electrical tests	Air clearances and creepage distances \| Specification: IEC 60664-1:2007-04 Insulating material group: IIIa Comparative tracking index (IEC 60112): CTI 250 Rated insulation voltage (III/3): 160 V Rated surge voltage (III/3): 2.5 kV minimum clearance value - non-homogenous field (III/3): 1.5 mm minimum creepage distance (III/3): 2.5 mm Rated insulation voltage (III/2): 160 V Rated surge voltage (III/2): 2.5 kV minimum clearance value - non-homogenous field (III/2): 1.5 mm minimum creepage distance (III/2): 1.6 mm Rated insulation voltage (II/2): 250 V Rated surge voltage (II/2): 2.5 kV minimum clearance value - non-homogenous field (II/2): 1.5 mm minimum creepage distance (II/2): 2.5 mm
Environmental and real-life conditions	Ambient conditions Ambient temperature (operation): -40°C ... 100°C (dependent on the derating curve) Ambient temperature (storage/transport): -40°C ... 70°C Relative humidity (storage/transport): 30 % ... 70 % Ambient temperature (assembly): -5°C ... 100°C
Packaging specifications	Type of packaging: packed in cardboard Outer packaging type: Dry bag