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PHOENIX CONTACT 1999725
PHOENIX CONTACT 1999725
PHOENIX CONTACTNon disponibile

SMC 1,5/ 5-G-3,81 HT BK CP3 - PCB header

PCB headers, nominal cross section: 1.5 mm2, color: black, contact surface: Gold, contact connection type: Pin, number of potentials: 5, number of rows: 1, number of positions: 5, number of connections: 5, product range: SMC 1,5/..-G-HT, pitch: 3.81 mm, mounting: THR soldering, pin layout: Linear pinning, solder pin [P]: 3.4 mm, number of solder pins per potential: 1, plug-in system: COMBICON MC 1,5, Pin connector pattern alignment: Standard, locking: without, mounting: without, type of packaging: packed in cardboard
Cod. Articolo: 1999725
Cod. Fornitore: 1999725
PHOENIX CONTACT


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Caratteristiche Tecniche
Specifiche
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Caratteristiche Tecniche
Product propertiesProduct line: COMBICON Connectors S
Product type: PCB headers
Product family: SMC 1,5/..-G-HT
Number of positions: 5
Pitch: 3.81 mm
Number of connections: 5
Number of rows: 1
Number of potentials: 5
Pin layout: Linear pinning
Solder pins per potential: 1
Electrical propertiesDegree of pollution: 3
MountingMounting type: THR soldering
Pin layout: Linear pinning
Material specificationsMaterial data - contact
Note: WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201
Contact material: Cu alloy
Surface characteristics: Tin-plated
Metal surface contact area (top layer): Tin (3 - 5 µm Sn)
Metal surface contact area (middle layer): Nickel (1.3 - 3 µm Ni)
Metal surface soldering area (top layer): Tin (3 - 5 µm Sn)
Metal surface soldering area (middle layer): Nickel (1.3 - 3 µm Ni)
Material data - housing
Color (Housing): black (9005)
Insulating material: PA
Insulating material group: IIIa
CTI according to IEC 60112: 325
Flammability rating according to UL 94: V0
DimensionsDimensional drawing: https://dam-mdc.phoenixcontact.com/rendition/156443151564/2464924391ea904289a8463658d8e4b7/-S204x204-FJPG
Pitch: 3.81 mm
Width [w]: 20.44 mm
Height [h]: 14.4 mm
Length [l]: 13.1 mm
Installed height: 11 mm
Solder pin length [P]: 3.4 mm
PCB design
Hole diameter: 1.2 mm
Environmental and real-life conditionsAmbient conditions
Ambient temperature (operation): -40 °C ... 100 °C (dependent on the derating curve)
Ambient temperature (storage/transport): -40 °C ... 70 °C
Relative humidity (storage/transport): 30 % ... 70 %
Ambient temperature (assembly): -5 °C ... 100 °C
Packaging specificationsType of packaging: packed in cardboard
Outer packaging type: Dry bag
Specifiche
ECLASSECLASS-11.0: 27460201
ECLASS-12.0: 27460201
ECLASS-13.0: 27460201
ETIMETIM 8.0: EC002637
UNSPSCUNSPSC 21.0: 39121400
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PER SCARICARE I DOCUMENTI E' NECESSARIO EFFETTUARE L'ACCESSO AL SITO

Approvals_00385.pdf

Manufacturer_declaration_05483.pdf

Technical_drawing_35538.pdf

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