Industrial Automation
Product properties | Product line: COMBICON Terminals L Product type: Printed circuit board terminal Product family: PTSPL 6/.. Number of positions: 1 Pitch: 0 mm Number of connections: 1 Number of rows: 1 Number of potentials: 1 Pin layout: Linear pinning Solder pins per potential: 4 |
Electrical properties | Nominal current IN: 41 A Degree of pollution: 3 |
Connection data | Connection technology Type: Circular conductor connection, single-pos. Nominal cross section: 6 mm² Conductor connection Connection method: Push-in spring connection Conductor cross section flexible: 2.5 mm² ... 6 mm² (Conductors with tin-plated litz wires are to be used, for example type PV1-F.) Conductor cross section flexible, with ferrule without plastic sleeve: 2.5 mm² ... 6 mm² Stripping length: 12 mm ... 15 mm |
Mounting | Mounting type: THR soldering / wave soldering Pin layout: Linear pinning Connection method: Push-in spring connection |
Material specifications | Material data - contact Note: WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201 Contact material: Cu alloy Surface characteristics: hot-dip tin-plated Metal surface terminal point (top layer): Tin (4 - 8 µm Sn) Metal surface soldering area (top layer): Tin (4 - 8 µm Sn) Material data - housing Color (): () |
Dimensions | Dimensional drawing: https://dam-mdc.phoenixcontact.com/rendition/156443151564/158b0afe23d1ab408f646eacfe25f655/-S204x204-FJPG Pitch: 0 mm Width [w]: 8.7 mm Height [h]: 13.7 mm Length [l]: 14.95 mm Installed height: 10.8 mm Solder pin length [P]: 2.9 mm Pin dimensions: 0.6 x 1 mm PCB design Hole diameter: 1.3 mm |
Mechanical tests | Conductor connection Specification: IEC60999-1:1999-11 Result: Test passed Test for conductor damage and slackening Specification: IEC60999-1:1999-11 Result: Test passed Pull-out test Specification: IEC60999-1:1999-11 Conductor cross section/conductor type/tractive force setpoint/actual value: 2.5 mm² / stranded PV1-F / > 50 N 6 mm² / stranded PV1-F / > 80 N |
Electrical tests | Temperature-rise test Specification: 60947-7-4/FDIS © IEC2012 Requirement temperature-rise test: Increase in temperature â¤45K Temperature cycles Specification: IEC60999-1:1999-11 Result: Test passed |
Environmental and real-life conditions | Vibration test Specification: IEC60068-2-6:2007-12 Frequency: 10 - 150 - 10 Hz Sweep speed: 1octave/min 5g (60.1Hz...150Hz) Amplitude: 0.35mm (10Hz...60.1Hz) Test duration per axis: 2.5 h Shocks Specification: IEC60068-2-27:2008-02 Pulse shape: Semi-sinusoidal Acceleration: 30g Shock duration: 18ms Test directions: X-, Y- and Z-axis (pos. and neg.) Ambient conditions Ambient temperature (operation): -40 °C ... 100 °C (Depending on the current carrying capacity/derating curve) Ambient temperature (storage/transport): -40 °C ... 70 °C Relative humidity (storage/transport): 30 % ... 70 % Ambient temperature (assembly): -5 °C ... 100 °C |
Packaging specifications | Dimensional drawing: https://dam-mdc.phoenixcontact.com/rendition/156443151564/5c9d0417f989e646afbbef42108ede86/-S204x204-FJPG Type of packaging: 32 mm wide tape [W] tape width: 32 mm [W2] coil overall dimension: 38.4 mm [A] coil diameter: 330 mm Outer packaging type: Transparent-Bag ESD level: (D) electrostatically conductive Specification: DINEN61340-5-1 (VDE0300-5-1): 2008-07 |
ECLASS | ECLASS-11.0: 27460101 ECLASS-12.0: 27460101 ECLASS-13.0: 27460101 |
ETIM | ETIM 9.0: EC002643 |
UNSPSC | UNSPSC 21.0: 39121400 |
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