1820767 PHOENIX CONTACT - Technology Bsa

SAMPLE PTSM 0,5/ 7-HHI-2,5-SMD - PCB header

PCB headers, nominal cross section: 0.5 mm², color: black, nominal current: 6 A, rated voltage (III/2): 160 V, contact surface: Tin, contact connection type: Socket, number of potentials: 7, number of rows: 1, number of positions: 7, number of connections: 7, product range: PTSM 0,5/..-HHI-SMD, pitch: 2.5 mm, mounting: SMD soldering, pin layout: Linear pad geometry, solder pin [P]: 2 mm, number of solder pins per potential: 1, plug-in system: COMBICON PTSM, Pin connector pattern alignment: Standard, locking: without, mounting: without, type of packaging: packed in cardboard, Article with anti-rotation pin

Product Code: 1820767

Partner cod.: 1820767

PHOENIX CONTACT

Product properties	Product line: COMBICON Connectors XS Product type: PCB headers Product family: PTSM 0,5/..-HHI-SMD Number of positions: 7 Pitch: 2.5 mm Number of connections: 7 Number of rows: 1 Mounting flange: without Number of potentials: 7 Pin layout: Linear pad geometry Solder pins per potential: 1
Electrical properties	Nominal current I_N: 6 A Nominal voltage U_N: 160 V Degree of pollution: 3 Contact resistance: 3.6 mÃ© Rated voltage (III/3): 63 V Rated surge voltage (III/3): 2.5 kV Rated voltage (III/2): 160 V Rated surge voltage (III/2): 2.5 kV Rated voltage (II/2): 200 V Rated surge voltage (II/2): 2.5 kV
Mounting	Mounting type: SMD soldering Pin layout: Linear pad geometry Processing notes Process: Reflow soldering Moisture Sensitive Level: MSL 1 Classification temperature T_c: 260°C Solder cycles in the reflow: 3
Material specifications	Material data - contact Note: WEEE/RoHS-compliant, free of whiskers according to IEC 60068-2-82/JEDEC JESD 201 Contact material: Cu alloy Surface characteristics: Tin-plated Metal surface contact area (top layer): Tin (3 - 8 µm Sn) Metal surface contact area (middle layer): Nickel (1.3 - 3 µm Ni) Metal surface soldering area (top layer): Tin (3 - 8 µm Sn) Metal surface soldering area (middle layer): Nickel (1.3 - 3 µm Ni) Material data - housing Color (Housing): black (9005) Insulating material: LCP Insulating material group: IIIa CTI according to IEC 60112: 175 Flammability rating according to UL 94: V0
Dimensions	Dimensional drawing: https://dam-mdc.phoenixcontact.com/rendition/156443151564/2464924391ea904289a8463658d8e4b7/-S204x204-FJPG Pitch: 2.5 mm Width [w]: 22.3 mm Height [h]: 5 mm Length [l]: 14 mm Installed height: 5 mm Solder pin length [P]: 2 mm PCB design Pad geometry: 1.2 x 3.2 mm Hole diameter: 1.1 mm
Mechanical tests	Visual inspection Specification: IEC 60512-1-1:2002-02 Result: Test passed Dimension check Specification: IEC 60512-1-2:2002-02 Result: Test passed Resistance of inscriptions Specification: IEC 60068-2-70:1995-12 Result: Test passed Polarization and coding Specification: IEC 60512-13-5:2006-02 Result: Test passed Contact holder in insert Specification: IEC 60512-15-1:2008-05 Contact holder in insert Requirements >20 N: Test passed Insertion and withdrawal forces Result: Test passed No. of cycles: 25 Insertion strength per pos. approx.: 4 N Withdraw strength per pos. approx.: 4 N
Electrical tests	Thermal test \| Test group C Specification: IEC 60512-5-1:2002-02 Tested number of positions: 8 Insulation resistance Specification: IEC 60512-3-1:2002-02 Insulation resistance, neighboring positions: >5MÃ© Air clearances and creepage distances \| Specification: IEC 60664-1:2007-04 Insulating material group: IIIa Comparative tracking index (IEC 60112): CTI 175 Rated insulation voltage (III/3): 63 V Rated surge voltage (III/3): 2.5 kV minimum clearance value - non-homogenous field (III/3): 1.5 mm minimum creepage distance (III/3): 2 mm Rated insulation voltage (III/2): 160 V Rated surge voltage (III/2): 2.5 kV minimum clearance value - non-homogenous field (III/2): 1.5 mm minimum creepage distance (III/2): 1.6 mm Rated insulation voltage (II/2): 200 V Rated surge voltage (II/2): 2.5 kV minimum clearance value - non-homogenous field (II/2): 1.5 mm minimum creepage distance (II/2): 2 mm
Environmental and real-life conditions	Vibration test Specification: IEC 60068-2-6:2007-12 Frequency: 10 - 150 - 10 Hz Sweep speed: 1octave/min 5g (60.1Hz...150Hz) Amplitude: 0.35mm (10Hz...60.1Hz) Test duration per axis: 2.5 h Durability test Specification: IEC 60512-9-1:2010-03 Impulse withstand voltage at sea level: 1.75 kV Contact resistance R₁: 3.6 mÃ© Contact resistance R₂: 3.8 mÃ© Insertion/withdrawal cycles: 25 Insulation resistance, neighboring positions: >5MÃ© Climatic test Specification: ISO6988:1985-02 Corrosive stress: 0.2 dm³SO₂on 300 dm³/40°C/1 cycle Thermal stress: 100°C/168h Power-frequency withstand voltage: 0.84 kV Ambient conditions Ambient temperature (operation): -40°C ... 100°C (dependent on the derating curve) Ambient temperature (storage/transport): -40°C ... 70°C Relative humidity (storage/transport): 30 % ... 70 % Ambient temperature (assembly): -5°C ... 100°C
Packaging specifications	Type of packaging: packed in cardboard